Qualcomm is simplifying the global implementation of gigabit-class LTE into the Xperia XZ2 series, the chipmaker announced Monday, shortly after Sony unveiled its latest Android flagships. Both the Xperia XZ2 and Xperia XZ2 Compact are powered by the company’s Snapdragon 845 chip which includes its RF Front End (RFFE) modem-to-antenna solution which streamlines the technologies needed for enabling the next generation of wireless speeds, Qualcomm claims. The X20 LTE modem and other connectivity solutions integrated into the Snapdragon 845 should allow Sony to take the wireless performance of its new flagships to the next level, both in terms of speeds and energy efficiency, according to the San Diego, California-based tech giant.
Qualcomm is quick to point out that many models of the Galaxy S9 and Galaxy S9 Plus will also be powered by its newest high-end chip, whereas about a dozen other original equipment manufacturers should utilize the same silicon in the near future. Most industry watchers are expecting the Snapdragon 845 to be found inside the vast majority of Android flagships released over the course of this year. The only high-profile mobile offerings that are set to circumvent the silicon are the international variants of the Galaxy S9 and Galaxy S9 Plus and Huawei’s 2018 flagships. In Samsung’s case, the company will be equipping its devices sold outside of North America and China with the in-house Exynos 9810, whereas Huawei will likely integrate the Kirin 970 made by its subsidiary HiSilicon into the P20 and P20 Plus, both of which are set to be launched on March 27 in Paris, France. The Mate 11 or however the successor to the 2017 Mate 10 series ends up being called is expected to be the first device sporting the Kirin 980 when it debuts in late 2018.
Sony is likely to stick with Qualcomm’s ultra-premium chip for the remainder of the year and should utilize the silicon in all of its Android flagships. The Xperia XZ2 and Xperia XZ2 Compact represent a major departure from the firm’s symmetrical OmniBalance design which Sony used for over half a decade by featuring minimal bezels and 18:9 display panels. Both devices are set to be released on a global level this spring.